Fanless AI-aided Vehicle Computer with Intel® Core™ 11th Gen CPU.
Main Features:
- Intel® 11th Gen Tiger Lake UP3, cost-efficient performance
- Compact, rugged and fanless design
- Rich I/Os, 2 x 2.5GbE, GbE, 4 x USB 3.2/2.0 & 3 x RS232/422/485
- 1 x 2.5” SSD, 1 x mSATA and 1 x NVMe SSD for data integrity
- Up to 3 combinations of LTE/5G, Wi-Fi 5/6 for mobile router function
- Triple display, VGA, HDMI and DP for multi video-out
- 9~36V DC-IN with ignition control & OCP/OVP
- Wide range operating temperature of -30°C~65°C (15W TDP)
- Military standard of anti-vibration/shock for OHV applications
- CE/FCC, UKCA, Emark Certified
VTC 7260-x is an in-vehicle AI-aided telematics computer designed with Intel 11th Gen. Tiger Lake UP3, which performs 25% more computing power than the former generation. Moreover, its 10-year product life-cycle policy can satisfy the long-term support suitable for any in-vehicle applications. With the compact, rugged, and fanless design, VTC 7260-x can widely be installed in any limited cabinet space with ease, and reduce the maintenance efforts while operating 24/7 services. In addition, the VTC 7260-x features diverse peripherals, such as 2.5GbE, USB 3.2, isolation CANBus, serial ports, ultra-speed NVMe storage, triple displays, audio in/out, DI/DO, and 9~36VDC with IGN control, making it a sophisticated in-vehicle computer.
To work as the edge AI, the user can install LTE/5G/Wi-Fi 5/6 modules along with Hailo AI accelerator (26TOPS) to deploy AI services, provided from cloud SaaS. In consideration of the harsh environment applications, VTC 7260-x can be operated at the temperature range of -30°C~65°C (15W TDP) and is compliant with MIL-STD-810G military standard for anti-vibration/shock. For the regulation, VTC 7260-x is compliant with CE/FCC Class A, UKCA, and EMARK (E13).
This article was originally published by NEXCOM International Co., Ltd.
NEXCOM is a Titanium member of the Intel® Partner Alliance, as a top tier of the Alliance. Intel and more than 500 global IoT partners of the Intel® Partner Alliance provide scalable, interoperable Intel® -based technologies and solutions that accelerate deployment of intelligent devices and end-to-end analytics. Close collaboration with Intel and each other enables Alliance members to innovate with the latest technologies, helping developers deliver first in-market solutions.
